EDAPLAN® LA 451
EMEA · America · Asia/Oceania
Product Details
Resources
Material Safety Data Sheet
315 kB
Technical Data Sheet
73.2 kB
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Sustainable Additives for a wide range of applications
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EDAPLAN® LA 451
EDAPLAN LA 451 reduces the surface tension of aqueous systems without increasing the foam formation. Thus substrate wetting, leveling and gloss are improved. EDAPLAN LA 451 is free of silicone and has no adverse effects on recoatability. This additive is compatible with all common resin systems.
Product Group
- Wetting & Leveling Agents
Market
- Industrial Coatings
- Printing Inks
Industrial Coatings
AC
L
MF
SW
Printing Inks
AC
L
SW
Target Formulation
- Water-based
Physical condition
- Liquid
Type
- Ester
Solvent
- Water
- Ethanol
Active / Solid content
68%
Availability
- EMEA
- America
- Asia/Oceania
Free From
- APE free
- Silicone free
- Biocide free
Ionic
- Anionic
EDAPLAN® LA 452
EDAPLAN LA 452 reduces the surface tension of aqueous systems without increasing the foam formation. Thus substrate wetting, leveling and gloss are improved. EDAPLAN LA 452 is free of silicone and has no adverse effects on recoatability. This additive is compatible with all common resin systems.
Product Group
- Wetting & Leveling Agents
Market
- Industrial Coatings
- Printing Inks
Industrial Coatings
AC
L
MF
SW
Printing Inks
AC
L
SW
Target Formulation
- Water-based
Physical condition
- Liquid
Type
- Ester
Solvent
- Water
Active / Solid content
83%
Availability
- EMEA
- America
- Asia/Oceania
Free From
- VOC free
- APE free
- Solvent free
- Silicone free
- Biocide free
Ionic
- Anionic
AC
Anti-Cratering
L
Leveling
MF
Metallic Flop & Brilliance
SW
Substrate Wetting
