EDAPLAN® 9101

EDAPLAN® 9101 is a solvent-free dispersing and wetting agent with an active content of 100%. It is designed for cathode NMP-slurries of conductive additives (e.g. CB, graphene, CNT, CNS, Ti3C2). EDAPLAN® 9101 optimizes the dispersing/milling efficiency,reduces the viscosity and improves the storage stability. The product enhances the electrode conductivity.

EDAPLAN® 9109 is a solvent-free dispersing and wetting agent with an active content of 100%. It is designed for cathode slurries to disperse and stabilize active materials (e.g. LFP, NMC, NCA, LCO, LMO) and NMP-slurries of conductive additives (e.g. CB, graphene, CNT, CNS, Ti3C2). EDAPLAN® 9109 optimizes the dispersing/milling efficiency,reduces the viscosity and ensures the stability of the viscosity. The product increases flexibility and reduce cracking of electrode layers. EDAPLAN® 9109 enhances the electrochemical stability.

EDAPLAN 9103® is a solvent-free dispersing and wetting agent with an active content of 100 %. It is designed for cathode slurries to disperse and stabilize active materials (e.g. LFP, NMC, NCA, LCO, LMO). EDAPLAN® 9103 reduces the viscosity and ensures the stability of the viscosity. The product increases flexibility and reduces cracking of electrode layers. EDAPLAN® 9103 improves the electrochemical stability.