EDAPLAN® 9103

EDAPLAN 9103® is a solvent-free dispersing and wetting agent with an active content of 100 %. It is designed for cathode slurries to disperse and stabilize active materials (e.g. LFP, NMC, NCA, LCO, LMO). EDAPLAN® 9103 reduces the viscosity and ensures the stability of the viscosity. The product increases flexibility and reduces cracking of electrode layers. EDAPLAN® 9103 improves the electrochemical stability.

EDAPLAN® 9109 is a solvent-free dispersing and wetting agent with an active content of 100%. It is designed for cathode slurries to disperse and stabilize active materials (e.g. LFP, NMC, NCA, LCO, LMO) and NMP-slurries of conductive additives (e.g. CB, graphene, CNT, CNS, Ti3C2). EDAPLAN® 9109 optimizes the dispersing/milling efficiency,reduces the viscosity and ensures the stability of the viscosity. The product increases flexibility and reduce cracking of electrode layers. EDAPLAN® 9109 enhances the electrochemical stability.

EDAPLAN® 9101 is a solvent-free dispersing and wetting agent with an active content of 100%. It is designed for cathode NMP-slurries of conductive additives (e.g. CB, graphene, CNT, CNS, Ti3C2). EDAPLAN® 9101 optimizes the dispersing/milling efficiency,reduces the viscosity and improves the storage stability. The product enhances the electrode conductivity.

EDAPLAN® 9013 is a solvent-free dispersing and wetting agent with an active content of 50%. It is designed for waterborne anode slurries to disperse and stabilize active materials (e.g. graphite, Si/C) and conductive additives (e.g. CB, graphene, CNT, CNS, Ti3C2). It is also suitable as dispersing agent in separators for PVDF coating layers. EDAPLAN® 9009 reduces the viscosity and ensures the stability of the viscosity. It optimizes the dispersing/milling efficiency. The product increases flexibility and reduce cracking of electrode layers. EDAPLAN® 9009 stabilize PVDF in an aqueous matrix and improves the homogeneity of the coating formulation.

EDAPLAN 9011® is a solvent-free dispersing and wetting agent with an active content of 35%. It is designed for waterborne anode slurries to disperse and stabilize active materials (e.g. graphite, Si/C) and conductive additives (e.g. CB, graphene, CNT, CNS, Ti3C2). EDAPLAN® 9011 reduces the visosity and ensures the stability of the viscosity. It optimizes dispersing/milling efficiency. EDAPLAN® 9011 increases flexibility and reduce cracking of electrode layers.

EDAPLAN® 9014 is a solvent-free dispersing and wetting agent with an active content of 40%. It is designed for waterborne anode slurries to disperse and stabilize active materials (e.g. graphite, Si/C). EDAPLAN® 9014 is also suitable for Al2O3 coating layers. It reduces the viscosity and ensures the stability of the viscosity. EDAPLAN® 9014 increases flexibility and reduce cracking of electrode layers. In Al2O3 coating layers the storage stability is improved and the water adsorption of the separator film is lower.